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Mixers
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M/A-COM offers a variety of low-level and high-level mixers in multiple configurations (including surface mount, TO-8, SMA connectorized, and microstrip compatible packaging). M/A-COM mixers use three types of designs: double balanced, triple-balanced, and load-insensitive designs. Most designs utilize packaged quad and discrete Schottky diodes. Well matched wide-band ferrite or printed dielectric baluns (transformers) provide optimum performance for conversion loss, noise figure, isolation and intermodulation products. |
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| Processes and Construction | ||||
| Mixer construction utilizes proven standard M/A-COM processes for solder, epoxy, gap weld, and hermetic seal. Diodes packages are epoxied to housings with the leads either soldered, with low temperature solder, or gap welded to the baluns. Baluns are attached to the mixer terminals by solder or gap weld. High temperature solder is often used in housing connections to prevent reflow during subsequent mixer attachment. Thin-film mixer designs have diodes epoxied to the substrate and gold-wire bonded to the baluns. M/A-COM solder, wire bond, and gap welding processes have proven to be extremely reliable for commercial, military, and space programs. | ||||
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M/A-COM
San Jose, 5300 Hellyer Ave, San Jose, CA 95138-1003 - (800) 366-2266
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